Thermal Marking for Biomechanical Speckling

Interesting research was presented recently at the 19th International Conference on Experimental Mechanics in Poland describing an alternative speckling technique for digital image correlation. In this work, a new methodology featuring thermal marking is deployed to carry out mechanical analysis and obtain deformation and displacement data using VIC-3D. It's early days for this research, but it shows a great deal of promise for biomechanical applications, and we're excited to see where it goes in the future.

Citation: Felipe-Sesé, L.; Andrés-Castro, F.; Molina-Viedma, Á.; López-Alba, E.; Díaz-Garrido, F. Digital Image Correlation Employing Thermal Marking. Phys. Sci. Forum 2022, 4, 3.