Applications
The DIC systems from Correlated Solutions excel in every imaginable application.
Our digital image correlation (DIC) systems have been implemented successfully in a wide range of applications from automotive to biological, and size scales from microscopy to large structures. All DIC systems are sold as turnkey solutions, which are customized to your measurement needs. Our systems include all hardware, software, technical support, onsite installation, and equipment training. We are dedicated to providing our customers with quality technical support and free software upgrades for one year after the date you receive your system.
VIC-3D Stereo Microscope & Capacitor Chip Assembly
The VIC-3D Stereo Microscope System The VIC-3D stereomicroscope system enables local analysis within very small elements. One industry that benefits from this small field imaging is microelectronics.
Adhesion Energy of Graphene on Nickel Substrates
In this study, for the first time, a novel full-field three dimensional (3D) blister test via stereo-digital image correlation (StereoDIC) was developed to characterize the interfacial interaction between as-grown graphene on nickel (Ni) and copper (Cu) substrates, respectively.
Printed Circuit Board (PCB) Measurement from Thermal Loading
Printed circuit boards (PCBs) have two primary functions: to provide electrical connections between terminals on the board, and to affix electronic components such as resistors, capacitors, and microchips via soldering. PCBs are used in many devices around the world on a day-to-day basis. Their small and lightweight design allows them to be found in nearly every electronic device, such as smart watches, phones & computers, and even digital cameras.
Strains Within a 300µm Diameter Ball Solder in BGA
The VIC-3D Stereo Microscope System enables local analysis within very small elements. One industry that benefits from this small-field imaging is microelectronics. Small electronics, like ball grid arrays (BGA) seen here, are too far small for traditional DIC to provide enough resolution to obtain local strain distribution within the actual ball solder.