This paper describes a series of experiments in which truncated cone geometries were formed using two multistage methods and compared to the same geometry formed using the traditional single stage method. The geometric accuracy and thickness distributions, including 3D thickness distribution plots, of each are examined using digital image correlation (DIC).

The proposed method is based on measurements of nonuniform deformations of the rail under thermal loading, as observed in computer simulations and laboratory investigations. The implementation uses thermal imaging and three-dimensional stereo-digital image correlation technology to acquire full-field deformations.

To measure the inhomogeneous 3D-strain fields present during inflation-extension testing of physiologically submerged micro-aneurysms, a Stereo Digital Image Correlation (StereoDIC) microscopy system is developed that revolves 15° stereo-angle cameras around a centrally-mounted target. Calibration is performed using submerged dot patterns and system accuracy verified using strain and deformation analyses for rigid body motions of speckle-patterned, micro-aneurysmal surrogates. In terms of the Green-Lagrange strain tensor and the 3D displacement fields, the results are stable even after 120 minutes, with maxima in both strain bias and strain standard deviation less than 2E-03 for all components, and micron-level displacement standard deviation.

The VIC-3D Stereo Microscope System The VIC-3D stereomicroscope system enables local analysis within very small elements. One industry that benefits from this small field imaging is microelectronics.

Understanding thermo-mechanical behavior of material can be a vital component when designing vehicles and structures that may become exposed to high temperatures. Virginia Tech’s Extreme Environments, Robotics, and Materials (ExtReMe) Laboratory focuses on the impact of extreme environments on materials. This includes research that is focused on understanding the thermo-mechanical behavior of materials both during and following fires. Experimental investigations are performed to understand the evolution of the material due to elevated temperature.

Studying the behavior of metals during a high-speed dynamic compression event has always been challenging due to the complex test set up and fast data capture rates required. Currently, very little literature is available regarding deformation behavior at strain rates of 10 to 500s-1. Utilizing high-speed cameras, the VIC-3D HS system can be used to quantify the surface displacements and strains in three dimensions over the entire field with great precision. Digital image correlation (DIC) has gained widespread popularity over recent years in such high-speed applications due to its high accuracy, flexibility and ease of use.

In this study, for the first time, a novel full-field three dimensional (3D) blister test via stereo-digital image correlation (StereoDIC) was developed to characterize the interfacial interaction between as-grown graphene on nickel (Ni) and copper (Cu) substrates, respectively.

Printed circuit boards (PCBs) have two primary functions: to provide electrical connections between terminals on the board, and to affix electronic components such as resistors, capacitors, and microchips via soldering. PCBs are used in many devices around the world on a day-to-day basis. Their small and lightweight design allows them to be found in nearly every electronic device, such as smart watches, phones & computers, and even digital cameras.

The VIC-3D Stereo Microscope System enables local analysis within very small elements. One industry that benefits from this small-field imaging is microelectronics. Small electronics, like ball grid arrays (BGA) seen here, are too far small for traditional DIC to provide enough resolution to obtain local strain distribution within the actual ball solder.