Understanding thermo-mechanical behavior of material can be a vital component when designing vehicles and structures that may become exposed to high temperatures. Virginia Tech’s Extreme Environments, Robotics, and Materials (ExtReMe) Laboratory focuses on the impact of extreme environments on materials. This includes research that is focused on understanding the thermo-mechanical behavior of materials both during and following fires. Experimental investigations are performed to understand the evolution of the material due to elevated temperature.

In this study, for the first time, a novel full-field three dimensional (3D) blister test via stereo-digital image correlation (StereoDIC) was developed to characterize the interfacial interaction between as-grown graphene on nickel (Ni) and copper (Cu) substrates, respectively.

Printed circuit boards (PCBs) have two primary functions: to provide electrical connections between terminals on the board, and to affix electronic components such as resistors, capacitors, and microchips via soldering. PCBs are used in many devices around the world on a day-to-day basis. Their small and lightweight design allows them to be found in nearly every electronic device, such as smart watches, phones & computers, and even digital cameras.

The VIC-3D Stereo Microscope System enables local analysis within very small elements. One industry that benefits from this small-field imaging is microelectronics. Small electronics, like ball grid arrays (BGA) seen here, are too far small for traditional DIC to provide enough resolution to obtain local strain distribution within the actual ball solder.

A plastic gear assembly was being evaluated to better understand interactions between component parts. In addition to strain measurements, it was desirable to obtain deflection data in three dimensions.

Digital Image Correlation has played a key role in the successful NASA SBKF test program. As the video footage shows, the VIC-3D system provides information that would be unimaginable with any other technology. Used in conjunction with FEA modeling, it will allow NASA to decrease weight and increase the payload of future rockets.

Noise and vibration characteristics are critically important for understanding the mechanical behavior of tires under various loading conditions. Measurements acquired during testing are used to validate finite element computer models to ensure the product meets safety, durability, performance, and longevity requirements.

The turnkey system from Correlated Solutions includes two Shimadzu HPV-X2 cameras which are conveniently controlled with Correlated Solutions’ software VIC-Snap UHS. The images are acquired during the event, downloaded, and then post-processed with VIC-3D.