This paper describes a series of experiments in which truncated cone geometries were formed using two multistage methods and compared to the same geometry formed using the traditional single stage method. The geometric accuracy and thickness distributions, including 3D thickness distribution plots, of each are examined using digital image correlation (DIC).

A rubber puck is mounted between two grips, and a set of reference images are acquired from a CT scanner at know increments. Each ‘slice’ of data is then analyzed to compute a static volume measurement. After the puck undergoes a compression load, images are acquired again by the CT scanner at the same locations. Digital Image Correlation algorithms are used to calculate the volumetric change or deformation at each individual voxel, which make up the 3D volume.

Studying the behavior of metals during a high-speed dynamic compression event has always been challenging due to the complex test set up and fast data capture rates required. Currently, very little literature is available regarding deformation behavior at strain rates of 10 to 500s-1. Utilizing high-speed cameras, the VIC-3D HS system can be used to quantify the surface displacements and strains in three dimensions over the entire field with great precision. Digital image correlation (DIC) has gained widespread popularity over recent years in such high-speed applications due to its high accuracy, flexibility and ease of use.

In this study, for the first time, a novel full-field three dimensional (3D) blister test via stereo-digital image correlation (StereoDIC) was developed to characterize the interfacial interaction between as-grown graphene on nickel (Ni) and copper (Cu) substrates, respectively.

Printed circuit boards (PCBs) have two primary functions: to provide electrical connections between terminals on the board, and to affix electronic components such as resistors, capacitors, and microchips via soldering. PCBs are used in many devices around the world on a day-to-day basis. Their small and lightweight design allows them to be found in nearly every electronic device, such as smart watches, phones & computers, and even digital cameras.

The VIC-3D Stereo Microscope System enables local analysis within very small elements. One industry that benefits from this small-field imaging is microelectronics. Small electronics, like ball grid arrays (BGA) seen here, are too far small for traditional DIC to provide enough resolution to obtain local strain distribution within the actual ball solder.

A plastic gear assembly was being evaluated to better understand interactions between component parts. In addition to strain measurements, it was desirable to obtain deflection data in three dimensions.

Noise and vibration characteristics are critically important for understanding the mechanical behavior of tires under various loading conditions. Measurements acquired during testing are used to validate finite element computer models to ensure the product meets safety, durability, performance, and longevity requirements.